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I GUSTI BAGUS BUDI DHARMA

Universitas Gadjah Mada S1 - Teknik Industri SINTA ID : 44221
412
SINTA Score Overall
187
SINTA Score 3Yr
412
Affil Score
187
Affil Score 3Yr
Latest number of Publication and Citations
Solderability of Sn-Cu-based Lead-free Solder with Low Content of Silver and Indium
Authors : IGBB Dharma Jabatan Kejuruteraan Rekabentuk dan Pembuatan, Fakulti Kejuruteraan …, 2010
2010 0 cited
T. Nonferr. Metal. Soc. T. Nonferr. Metal. Soc. 16, 1116-1120, 2006
Authors : I Dharma, MHA Shukor, T Ariga Materials transactions 50 (5), 1135-1138, 2009
2009 0 cited
The effects of adding silver and indium to lead-free solders
Authors : IGBB DHARMA, M Hamdi, T Ariga Welding journal 88 (4), 45-48, 2009
2009 7 cited
Soldering Handbook Soldering Handbook, 1999
Authors : I Dharma, MHA Shukor, T Ariga Materials transactions 50 (5), 1135-1138, 2009
2009 0 cited
Welding, brazing, and Soldering Welding, brazing, and Soldering, 1983
Authors : I Dharma, MHA Shukor, T Ariga Materials transactions 50 (5), 1135-1138, 2009
2009 0 cited
Wettability of low silver content lead-free solder alloy
Authors : IGBB Dharma, MH Abd Shukor, T Ariga Materials transactions 50 (5), 1135-1138, 2009
2009 16 cited
Brazing of Pure Copper with BAg-8 Braze Alloy
Authors : IGBB Dharma Jabatan Kejuruteraan Rekabentuk dan Pembuatan, Fakulti Kejuruteraan …, 2005
2005 0 cited
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Summary

Article Quartile
Research Output
  Scopus GScholar WOS
Article 2 4 5
Citation 10 23 14
Cited Document 1 2 3
H-Index 1 2 2
i10-Index 1 1 0
G-Index 1 1 1
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